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Electronics & IT

Adding high-functions
to IT and electronic
parts for PCs,
smartphones, etc.

Electronic materials

Mounting boards

Our products are used to remove flux used in processing and as surface modifier, antioxidant and protective layers.

  • potting and coating agents
    EIMFLEXNEW FRONTIER
  • solder/flux remover
    DK BE-CLEAR
  • antioxidant
    LAMIPROOF
  • Conductive pastes
Packaging materials

We have various high-function materials e.g. halogen-free phosphorus flame retardants for low dielectric resins and heat dissipating gap fillers.

  • phosphorus flame retardant
    PQ-60
  • Heat-dissipating gap filler
  • sealant, adhesive
    Two-component polyurethane resins
Printed circuit board (PCB) materials
  • Thermal crosslinking low-dielectric resins
Glass cloth
  • antistatic agent
    CATIOGEN

Display materials

We provide materials suitable for various parts e.g. anti-reflection films, polarizing plates, and backlight units.

Monitor
  • Adhesion improving primer
    Waterborne polyurethanes
  • High refractive index photocurable coating resins
    High-reactive low-viscous polyfunctional monomers
    Inorganic nanoparticle dispersions
  • antistatic agents
    ELEXCELRESISTATCATIOGEN
Flames
  • flame retardants
    PYROGUARD
Other materials
  • Materials for 3D printing
  • optical fiber connector component
    Zirconia feedstock

Semiconductor From front- to back-end processes

Semiconductor technology is evolving day by day as our life becomes more and more digitalized. We offer process agents, sealants, etc., based on our core surfactant technology.

Cleaning agents

We provide cleaning agents essential to semiconductor manufacturing processes based on our surfactant technology.

  • cleaning agents　DK BE-CLEARMETACLEA
  • Penetrants, dispersants
Photoresist materials

We develop photoresist materials that protect certain areas of wafers. We also develop photomask-related materials, and our cleaning agents are widely used.

  • Photocurable resins
  • Cleaning agents
Agents for CMP

We have a lineup of materials for chemical mechanical polishing (CMP) processes.

  • polymer dispersant　PITZCOL
  • High-functional cleaning agents・Organic base
Agents for tapes

We develop agents for back grinding and dicing tapes.

  • antistatic agent　ELEXCEL
  • photocurable resin　NEW FRONTIER
Sealants

We develop polyimide materials, which can be used as an encapsulant for power semiconductors that require high heat resistance.

  • Epoxy resin curing agent
  • Low thermal expansion resins・Polyimide materials
Packaging materials

We develop various high functional materials such as flame retardants for low dielectric resins and heat dissipating gap fillers.

  • phosphorus flame retardant　PQ-60
  • Heat-dissipating gap fillers
  • Two-component polyurethane resin (sealant)
  • High-reactive and low-viscous polyfunctional monomers
  • Thermal-crosslinking low dielectric resin
  • Metal antioxidant

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