Electronics & IT
Adding high-functions to IT and electronic parts for PCs, smartphones, etc.
Corresponding materiality
Electronic materials
Mounting boards
Our products are used to remove flux used in processing and as surface modifier, antioxidant and protective layers.
Potting and coating agents
Solder/flux remover
DK BE-CLEAR
Antioxidant
LAMIPROOF
Conductive pastes
Packaging materials
We have various high-function materials e.g. halogen-free phosphorus flame retardants for low dielectric resins and heat dissipating gap fillers.
Phosphorus flame retardant
PQ-60
Heat-dissipating gap filler
Sealant, adhesive
Two-component polyurethane resins
Printed circuit board (PCB) materials
Thermal crosslinking low-dielectric resins
Glass cloth
Antistatic agent
CATIOGEN
Display materials
We provide materials suitable for various parts e.g. anti-reflection films, polarizing plates, and backlight units.
Monitor
Adhesion improving primer
Waterborne polyurethanes
High refractive index photocurable coating resins
High-reactive low-viscous polyfunctional monomers
Inorganic nanoparticle dispersions
Antistatic agents
Frames
Flame retardants
PYROGUARD
Other materials
Materials for 3D printing
Optical fiber connector component
Zirconia feedstock
Semiconductor
From front- to back-end processes
Semiconductor technology is evolving day by day as our life becomes more and more digitalized. We offer process agents, sealants, etc., based on our core surfactant technology.
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Cleaning agents
We provide cleaning agents essential to semiconductor manufacturing processes based on our surfactant technology.
- Penetrants, dispersants
Photoresist materials
We develop photoresist materials that protect certain areas of wafers. We also develop photomask-related materials, and our cleaning agents are widely used.
- Photocurable resins
- Cleaning agents
Agents for CMP
We have a lineup of materials for chemical mechanical polishing (CMP) processes.
- High-functional cleaning agents
- Organic base
Agents for tapes
We develop agents for back grinding and dicing tapes.
Sealants
We develop polyimide materials, which can be used as an encapsulant for power semiconductors that require high heat resistance.
- Epoxy resin curing agent
- Low thermal expansion resins
- Polyimide materials
Packaging materials
We develop various high functional materials such as flame retardants for low dielectric resins and heat dissipating gap fillers.
- Heat-dissipating gap fillers
- Two-component polyurethane resin (sealant)
- High-reactive and low-viscous polyfunctional monomers
- Thermal-crosslinking low dielectric resin
- Metal antioxidant